Used CRYSTAL COMPLETE INTERFACE / CCI Hi-Lap 421/432 #9066377 for sale
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ID: 9066377
Polisher
4-Way, planetary lap
3mm stove-anameled steel cabinet
gear assembly and drive unit are built into a heavy casted aluminum corrosion resistant housing
Bearings, drive shafts and drive gears are made of stainless steel
Parts that come into contact with the abrasive slurries are coated with Zylon, or nylon in order to resist corrosion
Feed pump: optional
Manual bottle feed on top of the grooved plates
Waste slurry is collected in the aluminum well section beneath the bottom lap plate and is either returned to a waste container, or is recycled to the optional abrasive pump
Drive: 30:1 ratio with 190W DC drive motor
Electrical supply: 220/240V, single phase, 50/60Hz
Variable speed controller with Thirster DC controller
Inductive sensor
Programmable digital revolution counter
Control panel is fitted with a DC meter for a percentage reading of 100 RPM's for the machine's speed
Transat Automatic Lap Controller for auto shut-off and a target setting in MHz
Specs: 432, 421
Plate Diameter: 195mm, 195mm
Track Width 59mm, 36mm
Work pc Max Diameter 50mm, 30mm
DC Drive Motor 190 Watts, 190 Watts
Weight 150kgs, 150kgs
Carrier load 7 B/S, 5 B/S
Speed Variable, Variable .
CCI (CRYSTAL COMPLETE INTERFACE) Hi-Lap 421/432 is a state-of-the-art wafer grinding, lapping, and polishing equipment designed for the semiconductor industry. This CMP system consists of a spindle assembly, which houses the grinding and polishing components, and a chamber from which cooling water can be circulated throughout the unit. The spindle assembly includes several powerful grinding and polishing heads, as well as onboard software that enables a single operator to quickly and precisely adjust the grind settings for each head and the process parameters of the entire machine. The chamber is equipped with air/water separators, sweat heaters, circulating pumps and a variety of other components designed to keep the tool cool, and clean, throughout the grinding and polishing process. The process begins with the grinding of the wafer, done with the grinding heads. The grinding heads are adjustable, allowing the operator to select the speed, power, and diamond bush size they need to achieve the desired grind quality. This can be done in a single pass, or in multiple passes. Once the grinding process is completed, the asset is ready for lapping. Here, a lapping head is used to enable the operator to achieve a precise flatness in the wafer. The diamond bush, polishing head, and water temperature can be fine-tuned according to various product parameters. Once the lapping is complete, the model is ready for polishing. Polishing is similar to grinding, but the diamond bush size is smaller and the speed is higher. The polishing head is also adjustable, allowing the operator to select the speed, power, and diameter of the spindle that best suits the particular application. The operator can also select from a variety of combinations of polishing cloths and pastes to attain the desired surface finish. CRYSTAL COMPLETE INTERFACE / CCI (CCI) Hi-Lap 421/432 offers a flexible and cost-effective way to obtain the highest quality and most reliable wafer grinding, lapping, and polishing results. It is designed to accommodate a variety of product types, and its onboard software enables a single operator to quickly and precisely adjust the grind settings and process parameters of the entire equipment. Additionally, the air/water separators, sweat heaters, and circulating pumps in the chamber work to keep the system cool and clean throughout the entire grinding and polishing process.
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