Used DA ZHEN TC-100S #9363769 for sale

DA ZHEN TC-100S is a wafer grinding, lapping and polishing equipment designed for the production of advanced semiconductor device integrated circuits (ICs). It is ideal for advanced nanotechnology applications. The system is designed with a three-step process that combines precision grinding, lapping and polishing for the production of advanced ICs. TC-100S is equipped with a high-performance grinding stage that is driven by a direct-drive spindle motor. This variable-speed motor operates between 500 and 1,000 RPM and is capable of producing an exact, repeatable finish on the surface of the wafer that is ideal for advanced IC production. The grinding stage is also equipped with a workpiece focuser for precise wafer positioning and to ensure a precise cut depth across the entire surface of the wafer. The workpiece focuser is used in conjunction with the spindle motor to ensure that an exact finish is achieved, even under the most demanding conditions. The second step in DA ZHEN TC-100S process is lapping. This is accomplished using a rotary lapping wheel that is driven by a high-torque motor. This high-torque motor allows for the precise control of the lapping wheel speed as well as the depth to which the lapping wheel engages the surface of the wafer. The result is a polished surface with consistent high quality. The third step in TC-100S process is the polishing stage. This step utilizes a specialized diamond polishing wheel combined with a series of concentric polishing points. This combination ensures that the surface of the wafer is polished to a perfectly smooth finish and is free from any irregularities. The series of concentric polishing points help to ensure that the surface of the wafer is free from damage and will not be susceptible to cracking during the production process. The overall operation of DA ZHEN TC-100S unit is designed to be fast and efficient while still producing the highest quality results. The entire machine is controlled by a microprocessor and all of the settings are easily adjusted to ensure the optimal combination of grinding, lapping and polishing is achieved. The entire tool is also highly automated and almost completely maintenance free, making it ideal for advanced semiconductor device integrated circuit manufacture.