Used DAIICHI SEIKI 3200-C #9205040 for sale

DAIICHI SEIKI 3200-C is a highly versatile and advanced wafer grinding, lapping, and polishing equipment. As an industrial solution, its construction is intended to last through years of intense usage and its technologies are designed to maximize system effectiveness and maximize equipment life. 3200-C comes with a sophisticated Closed-Loop Control Unit that can monitor the surface roughness of the wafer during grinding processes, allowing variances to be easily detected and corrected. It also features multi-axis grinding and lapping capabilities, allowing for the processing of both flat and curved wafer surfaces. In addition, its overlay and microlapping technology produces a smooth, uniform finish without risk of polishing damage to delicate transistors, ICs, and other components. To further maximize machine effectiveness and meet industry requirements, DAIICHI SEIKI 3200-C is equipped with cutting-edge sensors and a unique Process Diagnosis Tool. This asset equips the model with in-depth monitoring and checks, ensuring that all processes are carried out in accordance with all the set industry standards and customer requirements. The equipment is outfitted with a selectable liquid cooling system, providing a safe and consistent cooling cycle that prevents thermal damage while preserving wafer integrity. In regards to its design, 3200-C is constructed with an ergonomic unit that minimizes user fatigue. Despite its advanced technology and wide array of features, the reliable, cost-effective device is easy to operate, making it ideal for many different grinding, lapping, and polishing projects. Overall, DAIICHI SEIKI 3200-C is a cutting-edge and versatile wafer grinding, lapping, and polishing machine that is designed to exceed industry standards. Its user-friendly design and long-lasting construction make it an ideal choice for a number of wafer-related applications.