Used DAITO Y1000 #9120571 for sale

DAITO Y1000 is a versatile wafer grinding, lapping, and polishing equipment that delivers exceptional surface finish and accuracy. Its versatile design and high degree of accuracy make it ideal for a variety of semiconductor applications, including CMP and photomask fabrication. The system is capable of processing wafers up to 8" in diameter. It features a powerful grinding head and a high-precision spindle to ensure accuracy and repeatability. The grinding head utilizes diamond-abrasive wheels that can provide high stock removal rates without damaging the wafer substrate. The spindle also features excellent vibration dampening characteristics, enabling faster grinding at higher RPMs. The unit is also capable of performing advanced lapping and polishing operations with ease. Its advanced lapping capabilities comprises post-grinding processes that apply low, controlled pressure to the wafer's surfaces to reduce surface irregularities. This technology also helps improve the wafer's opto-mechanical properties, and increases its dimensional stability. The machine's polishing capabilities are also remarkable, as it combines purpose-built technologies such as ion milling, ion implantation, and chemical-mechanical polishing (CMP) to finish the surface of a wafer to a mirror-like finish. Y1000's capabilities can be further extended through the use of optional processes, such as thermal oxidation, etching, electroplating, and more. Its automated processes increase accuracy and help reduce product defects, while its intuitive user interface makes it quick and easy to program. DAITO Y1000 is the perfect tool for a variety of semiconductor fabrication applications requiring high precision and accuracy. Its intuitive user interface makes it user-friendly, while its versatile range of processes and capabilities ensures superior results.