Used DAITRON / EMTEC CVP-80 #9151318 for sale

DAITRON / EMTEC CVP-80 is an automated wafer grinding, lapping & polishing equipment designed for the fabrication of precision substrates from wafers such as silicon and gallium arsenide. This system consists of a rotating grinding head with adjustable diamond cup wheels, a rotating lapping head with adjustable diamond platens, and a polishing head with adjustable platens to provide both flat and contour-grinding operations. Prior to operation, wafers are first mounted onto the unit's work table, then clamped in place by a vacuum within the work table which maintains a uniform mounting session throughout the process. EMTEC CVP-80 grinding machine employs a diamond wheel that has up to 18000 RPM of speed range capabilities. By utilizing a greater amount of revs, DAITRON CVP 80 is able to process higher quality wafer edges and also more quickly depending on the specific material being ground. Additionally, CVP 80 utilizes an adjustable motor speed knob which allows the operator to vary the diamond wheel speed and further customize the grinding process. The lapping head of DAITRON CVP-80 can run between speeds of 200 to 1200 RPM and can accommodate up to four diamond platens. This feature enables the operator to easily tailor the lapping process to the specific material being worked on. Additionally, the adjustable platens provide users with not only a uniform lapping output, but also offer even polishing for completely flat surfaces. For polishing applications, DAITRON / EMTEC CVP 80 offers an adjustable platens which can be tailored to the wafer material. From rough to fine polishing, CVP-80 is designed to have a sharpened leading edge that helps to quickly achieve polishing objectives and deliver high-quality results. Overall, EMTEC CVP 80 is a highly versatile wafer grinding, lapping & polishing tool that can accommodate a variety of materials and deliver precise results. Additionally, its adjustable features make it extremely user-friendly while its speed capabilities and wide range of platens ensure that even complex polishing operations are easily completed.