Used DANOBAT 1200 RP #176146 for sale

DANOBAT 1200 RP is a high-tech wafer grinding, lapping and polishing equipment specifically designed to ensure accuracy and repeatability in wafer production. This state-of-the-art system is capable of producing and finishing wafers with a maximum diameter of 400 mm and a thickness of 20 um with a premium finish. It offers the latest in innovative technologies such as a laser compensation unit and a self-centering chuck for the most reliable wafer grinding process. 1200 RP is equipped with two separate spindles for grinding and polishing. The grinding spindle is driven by a servo motor to ensure accuracy while the polishing spindle is driven by a stepper motor for precise motion control. The grinding spindle has a maximum speed of 400 rpm and the polishing spindle operates at up to 7000 rpm. The machine also features a laser compensation tool that maintains the stage position feedback to the control asset. This ensures that the spindles will operate at the correct position and the wafer will be ground and polished with a hyper-accurate finish. The self centering chuck is designed to hold the wafers securely in place and further reduce potential discrepancies between the grinding and polishing steps. Additionally, DANOBAT 1200 RP has two different through tool abrasive/polishing discs which can be used for grinding and polishing simultaneously. This ensures that the grinding and polishing processes are completed rapidly without contamination of the wafer. 1200 RP is one of the highest quality wafer grinding, lapping and polishing systems available. Its advanced design and meticulous construction ensure that wafers are produced with the utmost accuracy and quality. Its repeatability ensures that each and every wafer produced will be just like the last, ensuring the highest possible yield. This high performing model is the perfect solution for manufacturers looking to produce consistently excellent wafers.