Used DANOBAT RE-1200 #9255931 for sale
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ID: 9255931
Vintage: 2013
Grinding machine
Maximum piece diameter: 250 mm
Maximum points distance: 1200 mm
Maximum rectify diameter: 250 mm
Points height: 135 mm
Fast forward automatic header: 35 mm
Hydraulic table displacement: 0.5, 6 MTS/mn
Minimum table displacement: 2 mm
Header speed: 6
Speed header range: 55 a 500 rpm
Morse cone axis carried pieces: 5
Morse cone counterpoint: 3
Power supply: 1 CV
2013 vintage.
DANOBAT RE-1200 is a multi-functional wafer grinding, lapping & polishing equipment that offers a range of features and benefits for users. It is designed to provide advanced wafer grinding and polishing capabilities to laboratories or production sites. With a 12″ maximum wafer diameter, RE-1200 is ideal for large-scale operations involving high-precision wafer work. DANOBAT RE-1200 is driven by powerful low-vibration motors, and is capable of performing continuous grinding up to 8000 rpm. This allows for higher grinding accuracy and enhanced surface finish. The system also features a cutting-edge optical interferometric pattern recognition unit to ensure precision accuracy, even at high resolutions. Additionally, RE-1200 is equipped with a movable robotic arm for easy adjustment of complex grinding patterns. DANOBAT RE-1200 also boasts an innovative design which facilitates easy loading, unloading and transfer of wafers. To ensure maximum process efficiency, RE-1200 can be configured to operate autonomously, with the integrated intelligent automation machine eliminating the need for manual intervention. This allows users to save time and money, whilst taking advantage of unrivaled wafer grinding and polishing capabilities. In addition to its industry-leading features, DANOBAT RE-1200 is also equipped with a range of powerful safety features. This includes high-end protection systems to prevent electrical equipment from overloading, and an array of warning indicators for troubleshooting. Further to this, RE-1200 features a coated wafer handling tool to minimize the risk of contamination. All in all, DANOBAT RE-1200 is an advanced wafer grinding, lapping & polishing asset designed to meet the exacting needs of industrial production sites and laboratories. With its powerful and reliable motor drive, cutting-edge optical interferometric capabilities, easy loading & unloading, and advanced safety protection and automation technology, RE-1200 offers superior efficiency with enhanced accuracy.
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