Used DIMPLER D500i #293639487 for sale

DIMPLER D500i wafer grinding, lapping, and polishing equipment is designed to provide fast and cost-effective production of high-quality thin film substrates. The system is a two-stage grinding process that utilizes a planetary disk to grind the wafer from one side, and then an additional single disk to completely grind the entire wafer surface from the opposite side. The unit is equipped with a unique lapping and polishing technology that employs a series of abrasive brushes to achieve a highly smooth surface finish. The machine is built to provide a high degree of accuracy and consistency. The total run time per wafer is approximately one minute and thus results in faster turn around times and high throughput. The tool can also be placed on a granite floor or in a stable container to ensure long lasting and reliable performance. The planetary disk is designed to provide superior grinding speed due to its superior mechanical properties. This design provides the asset with considerably improved grinding speed and accuracy while maintaining uniformity of grinding pass. The planetary disk is equipped with CNC positioning and can be adjusted to various grinding traverses and loads. The single polishing disk is a unique design which allows for high throughput and increased surface consistency. This design uses vacuum application to remove dust and debris from the workspace as well as keep the abrasive surface clean. The single disk is equipped with diamond-dusted abrasive brushes that provide low wear and tear on the wafer surface. The abrasive brushes help to prevent premature wear in the grinding process and guarantee even polishing of the surface. D500i has a flexible setup that allows users to change the grinding parameters depending on the materials that are being processed. The model is also equipped with a range of sensors to monitor the grinding process and ensure that the wafers are evenly ground. The equipment can be used to process a variety of substrates such as Si and GaAs materials as well as a range of other thin film substrates. Overall, DIMPLER D500i wafer grinding, lapping and polishing system is a reliable, cost-effective and accurate solution for grinding, lapping, and polishing thin film substrates. Its flexible setup allows users to adjust grinding parameters, while the superior mechanical properties of the planetary disk contribute to fast and accurate grinding. The single disk, with its diamond-dusted abrasive brushes, provides even and low wear surfaces, making it a reliable and efficient solution for thin film wafer processing.