Used DISCO (14) CPU Boards for DGP 8760 #293630309 for sale

DISCO (14) CPU Boards for DGP 8760 are custom-designed and built for advanced wafer grinding, lapping, and polishing tasks. The boards employ a high-performance Micro Control Unit (MCU) and a Direct Memory Access (DMA) peripheral device that provide unparalleled control and flexibility for a variety of materials and tasks. The MCU drives the board and all its subsystems, including the integrated data-acquisition and motion-control features of the board. An onboard Data Capture and Control Interface (DCCI) enables communication with a wide range of external devices and systems. The µC also drives an Ethernet port, providing unparalleled flexibility in system configuration and connectivity. The board also contains five independent pulse motors, providing precise control over the grinding/lapping processes. The motors are driven by three-phase power, allowing for flexible system and speed control. In addition, the board features a high-resolution analog-to-digital converter (ADC) and a high speed serial interface (HSI) that enable real-time wafer metrology. The board includes several extra features to facilitate wafer grinding, lapping and polishing. Intuitive graphical user interfaces (GUIs) and Human-Machine Interfaces (HMIs) enable operators to program and control various tasks quickly and safely. The intuitive user-interface also allows for a fast and easy setup for different grinding and polishing applications. DISCO (14) CPU Board for DGP 8760 is an ideal solution for wafer grinding, lapping and polishing needs. The board provides a comprehensive range of features and benefits that enable efficient and precise control of grinding and polishing processes. With its advanced features and capabilities, this board is an ideal component in a wafer grinding, lapping and polishing system.