Used DISCO DAG 810 #293618525 for sale

DISCO DAG 810 is a highly precise wafer grinding, lapping, and polishing equipment specifically designed for grinding and processing semiconductor materials. The system can process single wafers up to 8 inches in diameter and is ideal for preparing devices and test wafers for further processing. The unit includes a high precision CNC-controlled grinding head, capable of providing consistent and accurate control over feedrates and spindle speed for precise grinding. The grinding head features an operator-friendly interface allowing easy set-up and access to optimized feedrate and spindle speed settings. In order to prevent degradation from thermal or other contamination, the grinding head also features thorough separation of its grinding mechanism from the main body which helps in keeping the internal components cool. The machine is incorporated with a powerful measuring and analysis tool making it easy to make corrections or fine tune the grinding operations for optimal accuracy and precision. The asset allows for analysis and feedback of grinding operations in order to uncover additional insights and improve grinding quality. Furthermore, an advanced wafer balancing model ensures balanced grinding and the equipment also includes automated wafer indexing, feed and forward routines. The system is equipped with an advanced polishing process that ensures a complete surface finish without any scratches, pits, or scratches. The pre-polishing process smoothes the wafer surface while minimizing the formation of micro-particles. The polishing process is performed as per customer requirements, taking into account various polishing parameters such as slurry concentration, abrasive type, polishing speed and pressure. The post-polishing process involves polishing the wafer surface to a higher level of smoothing and finishing. Finally, the unit features an integrated environment for monitoring and controlling the entire process. This environmental control machine allows the synchronization of grinding, lapping, and polishing processes to reduce substrate damage or contamination. This ensures uniformity of the processing results even over a large lot size.