Used DISCO DAG 810 #293747141 for sale

DISCO DAG 810 is a state-of-the-art wafer grinding, lapping and polishing equipment designed for semiconductor manufacturers looking for precision and throughput. This system is designed in accordance to international standards and features intelligent controls to streamline processes. It features a six-stage metal-mechanical process machine with three integrated unidirectional grinding stone locations, supported by a highly advanced control unit which ensures true continuous maintainability of layered end products. DISCO DAG810 also features a powerful motor and onboard vibration isolation to ensure operation in a wide range of temperatures without compromising performance. The grinding stones are cooled to prevent thermal heating during the grinding process. With its precise controls, DAG 810 is capable of milling, lapping and polishing fragile carbide, diamond, and precision abrasive surfaces with repeatable accuracy. DAG810 has a RFID enabled controller and monitoring machine for ease of use and real-time synthesis of process information. All of the parameters can be set, monitored and modified from an easy-to-use touch screen interface which monitors the grinding stones, the speed, the particle size and the pressure. The computer interface also allows for troubleshooting and maintenance from the comfort of your office. DISCO DAG 810 is ergonomically designed and integrates a modular, low cost and high performance vacuum tool for improved substrate processing. The advanced filtration asset ensures a silica-free work environment, reducing the possibility of airborne contamination and propellant residue. The use of a water cooling protective housing also helps reduce static and tool wear while optimizing the process time. In addition, the lack of moving components in the grinding, lapping and polishing process reduces particle contamination and minimizes substrate stress. To ensure consistent results, the wafers are inspected with the latest process technology, such as defect and abrasion characterization, during and after the grinding process. DISCO DAG810 is a fully automated precision wafer grinding, lapping and polishing model that offers the ultimate in automation and repeatable accuracy. It provides a high level of control flexibility and is suitable for grinding and polishing a wide range of substrates. The equipment also integrates a computer interface for parameter settings, monitoring and troubleshooting.