Used DISCO DAG 810 #293750691 for sale

DISCO DAG 810 is a wafer grinding, lapping and polishing equipment, designed to offer high speed, high accuracy, and high throughput for semiconductor wafer fabrication. The system consists of three individual grinding, lapping and polishing sections, which can be operated in either single mode or combined mode. The grinding section utilizes a high-performance, low-vibration grinding spindle, capable of rotating at up to 50,000 RPM, and equipped with a diamond wheel. This wheel is designed to abrade the substrate using diamond abrasive particles, removing excess material from the wafer and preparing the surface for the lapping and polishing stages. The lapping and polishing sections, on the other hand, use different techniques to refine and polish the surface of the wafer. The first is ultrasonic lapping, which uses a high-energy liquid media that impinges against the wafer's surface. This media imparts a vibratory action which helps to remove residual material, yielding a smoother surface. The second is barrier lapping, which uses a polishing sheet applied to a soft media, such as foam. Barrier lapping helps to further refine and polish the surface of the wafer, producing a highly uniform result. Finally, the unit includes a polishing section, which employs a variety of polishing cloths and diamond slurry to refine the wafer's surface even further. This process produces a highly refined surface and smooth finish, suitable for use in semiconductor production. DISCO DAG810 is an incredibly dynamic and versatile machine, capable of producing a wide variety of different grind, lapping, and polishing processes. This tool allows for rapid and reliable results, vastly improving wafer wafer production times, and reducing the costs associated with producing semiconductor wafers.