Used DISCO DAG 810 #293759189 for sale

DISCO DAG 810 wafer grinding, lapping & polishing equipment is an automated, stand-alone system designed to provide precision metrology and grinding capabilities to the semiconductor and related industries. The unit consists of several modules, including a scanning stage and a grinding and polishing unit with a fixed polishing table and a wafer holder. The machine can easily be integrated into existing manufacturing operations. The main features of DISCO DAG810 include a large grinding stage with a wide variety of tools, such as diamond grinding wheels, discs, and diamond felt wheels. These tools allow the user to effectively perform various grinding processes, such as high-precision grinding and lapping. The wafer holder includes an adjustable travel stroke to accommodate a range of shaped wafers. The grinding stage is also equipped with a jig for raising and lowering the wafer, which permits greater control when performing grinding operations. The wafer holder also doubles as the polishing module, which features a pneumatic mechanism for raising and lowering the polishing table quickly and with precision. This feature is ideal for operations with high-quality polishing operations, such as CMP and CP polishing. DAG 810 also features a scanning stage for inspecting, measuring and analyzing the wafers during the grinding and polishing operations. The tool is equipped with a large field of view for accurately checking and scanning parameters of a wafer, such as diameter, wafer flip angle and tilt. The scanning stage also includes an automated, high-precision 3-dimensional scanning mechanism to analyze a variety of parameters such as surface quality, surface finish and defect criteria. The asset also includes an automated CCD imaging model, which allows the user to perform various types of wafer inspections and/or evaluate the surface finish. The equipment also includes a touchprobe measurement system that can be used to accurately measure the thickness, radius of curvature and angularity of a wafer. Overall, DAG810 automated grinding, lapping and polishing unit is ideal for those operations requiring precise and accurate grinding and polishing operations. The machine is designed with features and product support for greater accuracy, repeatability and reliability. It provides users with a secure and reliable way of grinding and scrutinizing semiconductor wafer for the highest yields.