Used DISCO DAG 810 #293760385 for sale

DISCO DAG 810 is an advanced wafer grinding, lapping, and polishing equipment designed to provide accurate and efficient processing of semiconductor wafers. It is designed for high-volume production and is capable of grinding, lapping, and polishing to a consistent, high-precision result. The system has a wide range of capabilities and features, including the ability to process wafers up to 8" in diameter with a roughness of up to 0.2 microns. The machine also features a precisely adjustable grinding and polishing pressure that ensures a consistent and even distribution of lapping and polishing force. An automatic pressure control unit ensures that performance remains uniform over an extended span of time. DISCO DAG810 offers a wide range of polishing types, including single-side, double-side, and multi-sided lapping and polishing. These features enable the machine to process both smooth and rough surfaces and achieve a range of different finishes. The tool is also able to grind and lap in different directions the same surface for maximum uniformity and accuracy. DAG 810 is designed to be both easy to operate and cost effective. The user interface is designed to be intuitive and user-friendly, allowing operators to quickly set up and run the asset with minimal effort. The model also features a broad range of options, including both mobile and stationary versions, and numerous custom configurations. The machine runs on a 220V/60 Hz power supply and is designed to meet safety requirements set by both domestic and international standards. Overall, DAG810 is an advanced and reliable grinding, lapping, and polishing equipment, offering accurate and efficient processing of semiconductor wafers. It has a range of features that enable it to process wafers of various sizes and achieve a range of different finishes. The system is easy to operate and cost effective, making it suitable for high volume production.