Used DISCO DAG 810 #293770928 for sale

DISCO DAG 810 is a wafer grinding, lapping, and polishing equipment that has been designed to provide high-performance wafer processing. This system is ideal for the production of semiconductor and optical device wafers. Its grinding process involves rotating multiple plates at high speeds then pressing them together in order to mill and grind. As the plates spin, a stream of abrasive particles is shot through tiny jets at the plates which then grind away at the wafer that is sandwiched between them. This process is capable of producing substrates with a very high surface finish. The polishing process uses a vibratory sander and proprietary polishing compounds to achieve a final polishing finish. It operates in two stages: first the sander oscillates between two plates, removing milling marks and then very fine particles are used to further refine the surface roughness. The lapping process utilizes a combination of a special diamond paste and a revolving lap wheel to produce a high-precision finish on the substrate. The paste is spread across the lap wheel and is fed into it at a controlled rate. This removes any scratches and irregularities that may be present on the substrate. Together, the three processes provide a unique and powerful set of capabilities for wafer grinding, lapping, and polishing. This unit is suitable for a variety of applications, including those in the semiconductor and optical device industries. Its suite of advanced features, including process control, and high-performance components, enables the machine to achieve excellent results. DISCO DAG810 also features built-in safety features, protection from dust contamination, and temperature compensation. In summary, DAG 810 provides an affordable, reliable and high-performance solution for grinding, lapping, and polishing a wide variety of substrates for the semiconductor and optical device industries.