Used DISCO DAG 810 #293773614 for sale

DISCO DAG 810 is a wafer grinding, lapping and polishing equipment designed specifically for semiconductor wafers and other non-conductive substrates. Its patented design features a high precision, variable speed grinding and polishing head, variable speed carrier rotation, and dry polishing capability, making it one of the most versatile grinding and polishing systems on the market. The grinding/polishing head of DISCO DAG810 is capable of moving up and down as well as rotating in both directions. This allows the wafer to be accurately and precisely ground and polished without the risk of causing damage. The speed of the grinding/polishing head can also be adjusted, allowing for the grinding and polishing to be performed at the optimal speed for the wafer being processed. DAG 810 also features a carrier rotation system with variable speed rotation from 400rpm to 800rpm. This allows the wafer to be accurately and precisely rotated at the optimal speed as it is being grinding and polished. The dry polishing function of the unit is powered by a powerful three-phase motor, enabling the polishing to be carried out at the optimal speed for the wafer being processed. The machine also features a wafer chucking fixture which securely grips the wafer and allows it to be precisely rotated during the grinding and polishing process. The wafer can be securely clamped in three different positions to allow for optimal grinding and polishing of the different surfaces. DAG810 also features a built-in cooling tool. This ensures that the wafer remains cool during the grinding and polishing process, which reduces the risk of thermal shock and ensures the accuracy of the finished product. The polished wafer is then automatically unloaded through the use of a special unloading ram. DISCO DAG 810 is a highly advanced and efficient grinding and polishing asset that is ideal for the busy semiconductor manufacturer. Its advanced features provide unparalleled precision and accuracy, making it an invaluable tool for the production of high-quality semiconductor wafers.