Used DISCO DAG 810 #293794154 for sale

DISCO DAG 810 is a state-of-the-art wafer grinding, lapping and polishing equipment designed for precision and high-volume production of high-precision wafers. The system features a robotic arm and integrated optical inspection, allowing for automated operation and quality assurance. The grinding step incorporates a DCG003A Grinding Wheel with a controlled speed of 600 to 800 rpm. The rough grinding process uses a fine diamond grit to achieve the required 45° chamfering, ensuring perfect wafer cornering with minimal burrs. The grinding device feeds an adjustable rate of 600 to 4000 RPM, allowing for high pressure grinding of various thicknesses and specific features. The unit also features a pressure sensor, allowing for accurate control and monitoring of grinding parameters. The lapping step involves abrasives such as diamond slurries and dry polishing pads. The slurries and pads are hydro-kinetically coupled to the wafer surface, enabling high-accuracy polishing and removal of material. The lapping is rotationally controlled, with rotational speed ranging from 50 to 1000 RPM, ensuring a consistent polishing effect. Following the lapping step, the polishing process occurs. In the polishing step, a variety of polishing compounds are applied to the wafer surface using a DCP-T100 process head, uniquely designed for high-precision polishing. The device is pneumatically actuated for reliable and repeatable polishing operations. The pressure used for polishing is adjustable, allowing for optimal application of rotational speed and pressure. The integrated vacuum machine prevents abrasive slurry from scattering and maintains a clean work environment. Finally, the integrated optical inspection helps to optimize the production quality by inspecting chamfering shape, burr height, corner shape, and presence of any foreign material present on the wafer surface. This tool can test 100 wafers per minute, allowing for efficient quality control. In short, DISCO DAG810 wafer grinding, lapping, and polishing asset is designed to provide high-precision and high-volume production of wafers. The integrated optical inspection model allows for automated operation and quality assurance of the production process. This equipment is ideal for precision applications requiring top-notch performance and quality.