Used DISCO DAG 810 #293799989 for sale

DISCO DAG 810 is a high-performance wafer grinding, lapping, and polishing equipment designed for cluster tool applications. It is a turnkey system, combining several process steps including grinding, lapping, and polishing in one machine. Using this unit, wafers can be polished without changing the setup parameters due to the powerful spindle control and the disk lapping plate. The machine is equipped with a liquid crystal display, which allows the user to operate the tool efficiently and smoothly. DISCO DAG810 features a central spindle, a work support fixture, a lapping plate, a top plate and a spindle drive unit. The central spindle is capable of supporting wafers of various diameters and thicknesses. It is also adjustable in order to suit the needs of different applications. The lapping plate has a minimum inner diameter of 200mm, and can rotate up to1000 RPM for grinding and polishing wafers with minimum damage. The top plate is designed to support the wafers, and can be fitted with a vacuum chuck to hold them securely in place. DAG 810 is driven by a powerful brushless DC motor, and controlled by an industrial grade PC for optimal efficiency and performance. The unit is fitted with a controller and a sump asset for automatic feeding of fluids. The controller can be programmed to achieve highly accurate grinding results by adjusting the peak current, the max speed and the feed force as required. It is also equipped with auto focus control and anti-interference software to ensure the safety of the model and its components. DAG810 is a high-precision wafer grinding, lapping, and polishing equipment that is suitable for various types of wafers. It is capable of achieving high-quality results with minimum damage to the wafers. The unit is extremely efficient and economical, making it suitable for a variety of applications.