Used DISCO DAG 810 #293811449 for sale

DISCO DAG 810 is a wafer grinding, lapping and polishing machine designed by German company DISCOTEK GmbH. It is equipped with a built-in vacuum equipment, a pressure gauge, a temperature control unit and integrated cooling system, allowing for low temperature grinding, lapping and polishing processes. The unit's grinding mechanism is based on a rotary table, horizontally mounted on a rotating vertical shaft. Through its rotational movement, a substrate holder holds the wafer fixed in position, while abrasive disk, mounted on the spindle of the grinding head, grinds the surface at adjustable speeds. The machine's lapping and polishing processes use a platen, which consists of two rotary tables with diameters of 375 and 420mm respectively, each containing 8 to 12 abrasive disks that are capable of achieving different angles and depths. During lapping, the platen is mounted horizontally, while during polishing it is mounted vertically. DISCO DAG810 is able to work with both single and multiple side grinding and lapping, allowing it to achieve highest speed, tighter tolerances and reduced processing time. It is also equipped with a pressure controller, allowing the user to precisely control the pressure applied to the surface of the wafer and to precisely adjust the shape of the edges. The tool is also able to work up to a maximum diameter of 600mm, making it ideal for grinding, lapping and polishing larger wafers and substrates. DAG 810 is easy to operate and maintain, featuring a user-friendly control and display that offers diagnostic information and automatically displays a status report, reducing maintenance and setup times. The asset is capable of delivering excellent results for precision grinding, lapping and polishing, making it an ideal choice for a wide range of materials, including ceramics, semi-conductors and magnetic materials.