Used DISCO DAG 810 #293815106 for sale

DISCO DAG 810 is an advanced and highly precise wafer grinding, lapping and polishing equipment designed for the industrial production of high quality materials such as silicon, sapphire, sapphire substrates, silica, GGG and other similarly hard materials. The system's complex high-speed motor is designed to deliver highly precise grinding results while keeping production costs low. The motor is also capable of reaching speeds of up to 17,000rpm, enabling fast and efficient production. The unit uses a combination of abrasive grinding, lapping and polishing tools to achieve the desired surface roughness and finish. Several interchangeable lapping heads are provided that enable easy switching between grinding and polishing operations depending on the material being processed. The machine also features a programmable controller which allows for the automatic selection of proper grinding and polishing processes for a given material. This helps to eliminate potential human error and maximize productivity. The grindstone and lap tool holders can be moved both horizontally and vertically to ensure an optimal grinding/polishing operation. High-precision grinding is enabled via the installation of an independently adjustable gap between the grinding plate and flat surface. This allows for maximum precision and smooth finish surfaces with no furrows or defects. The tool also features an AC cycle timer and polishing velocity control to enable precise grinding and polishing cycles. It comes equipped with a variety of tools and accessories such as a polishing cloth, removable lapping barrier and a vacuum cleaner that can be attached to the grinding head to help reduce dust emissions. To ensure safety and uniformity during use, the asset includes an automatic overload protection function as well as an air-cooling model to help maintain consistent temperatures. The unit is highly durable and corrosion resistant, making it well-suited for industrial environments and long-lasting use. Overall, DISCO DAG810 wafer grinding, lapping and polishing equipment is an ideal solution for engineers and manufacturers seeking high precision and efficient production with minimal material waste. It is robust, user-friendly and has a long useful life.