Used DISCO DAG 810 #9232657 for sale

DISCO DAG 810 is a robust and reliable wafer grinding, lapping and polishing equipment designed to provide superior performance in a wide range of applications. This system is designed to reliably process high-volume wafers while maintaining the highest levels of accuracy and repeatability. The high-performance grinding and polishing process enables superior wafer finish results. This unit features a large grinding wheel with an adjustable force motor, featuring a high speed of over 7,000 rpm. This provides a fast and accurate grinding process for producing a high degree of surface finish on your wafers. Additionally, the grinding wheel is capable of simultaneously grinding both the top and bottom surfaces of the wafer with a gap which automatically adjusts between 0.3 and 0.8 mm. The integrated lapping and polishing process utilizes three interchangeable heads with a waterjet lapping and a slurry polishing wheel to provide superior lapping and polishing results. Each lapping and polishing head can be set to a different wheel diameter or speed to optimise the grinding and polishing process. The three polishing heads can be an ideal combination to achieve a high surface finish and a uniform step height within the wafer. The waterjet lapping process helps to reduce the risk of contamination, while the slurry polish wheel helps to reduce the edge effects while further enhancing the surface finish. DISCO DAG810 machine also features a compact, efficient design which reduces setup and operation time. The tool's integrated control panel, with colour touchscreen, is designed to be user friendly and provides convenience and rapid operation. Additionally, the included cooling conveyor asset helps to minimize vibration associated with the process. DAG 810 is an ideal choice for wafer grinding, lapping and polishing applications in a variety of industries, from semiconductor and automotive to medical device production. With its high speed, robust construction, flexible configuration and superior surface finish results, this model is an excellent way to produce high-quality wafers in an efficient and cost-effective manner.