Used DISCO DAG 810 #9237354 for sale

DISCO DAG 810 is a wafer grinding, lapping & polishing equipment. It is designed to work with various types of materials such as silicon, gallium arsenide and sapphire for ultra-precision semiconductor applications. The system is capable of grinding, lapping and polishing with a high degree of uniformity in flatness and thickness. DISCO DAG810 has a host of features and configurations that enhance its versatility and enable it to perform as an effective grinding, lapping and polishing solution. DAG 810 includes a highly precise in-plane grinder, a horizontal plane lapper, a precision polisher, and a full set of compatible consumables. With a powerful precision driving unit, the grinder is capable of grinding a variety of materials with excellent results. The lapper enables the application of parallelism and uniformity to the plated surfaces at the microscopic levels and allows for a high degree of accuracy. The polisher, on the other hand, is designed with rotating wafer polishing technologies to give a smooth and glossy finish on the silicon material. The machine is easy to learn and operate and allows for faster wafer processing, making it suitable for semiconductor production. The flatness measurement and control tool further allows for real-time monitoring of the accuracy and uniformity of the plated surface across the entire working area of the machine. This ensures that all necessary specifications are met, allowing for industrial grade productions. Lastly, the machine is equipped with state of the art safety systems in order to protect operators and the surrounding machines. Therefore, DAG810 is a complete wafer grinding, lapping and polishing asset offering unparalleled precision and control in chip making processes. The model is easy to use and can quickly yield industrial grade results in the semiconductor production industry. Furthermore, its efficient safety measures provide maximum protection and health benefits to operators.