Used DISCO DAG 810 #9245857 for sale

DISCO DAG 810 is a powerful wafer grinding, lapping, and polishing equipment for the semiconductor industry. Utilizing a unique combination of abrasive media with its three-way abrasive media mix head, the 810 enables flatness and very consistent surfaces on semiconductor and other engineered substrates. The system is precision manufactured to achieve the highest quality results. The 810 provides a safe and ergonomic production environment for operators, with an integrated air filtration unit, an intuitive interface and an adjustable arm for improved accessibility and comfort. The 810 also has a built-in spindle cooling machine, ensuring efficient and reliable wafer grinding, lapping and polishing processes. The 810 utilizes the width of its grinding wheel (125 mm) to ensure a faster process and higher degree of surface quality while simultaneously providing a uniform and granular surface finish at the same time. The speed of the spindle is 1000 rpm and the feed rate is 1-15 mm/s, providing a range of grinding, lapping and polishing options. The 810 also has a dust and particle collection tool, running a collection unit that collects particles generated during the wafer grinding, lapping and polishing processes, allowing for a reduced impact on the quality of the substrate surfaces. Furthermore, it houses an embedded asset monitoring and control, including alarms, errors and performance details in real time. The 810's versatility, stringent quality control and reliable results make it an ideal choice for semiconductor manufacturers who are looking for an efficient and durable wafer grinding, lapping, and polishing model for their production lines. With the 810's ergonomic design, precision engineering, and intuitive interface, semiconductor manufacturers can look forward to achieving consistent and reliable results.