Used DISCO DAG 810 #9249939 for sale

DISCO DAG 810 Wafer Grinding, Lapping and Polishing Equipment is an ideal system for single-side grinding, lapping, and polishing of semiconductor wafers. The unit is designed for quick and easy operation, offering reliable and efficient wafer processing. DISCO DAG810 has an automated machine that can process up to eight wafers of up to 6 inch in diameter and up to 100 μm in thickness. It features a diamond grinding wheel which can provide a high precision surface finish up to 0.1 micron Ra and is suitable for use with silicon, quartz, and sapphire. The tool also features an automated air bearing lap plate which has a spindle speed range of 1-1000 rpm to accommodate different materials and process conditions. The asset can be equipped with a choice of process heads depending on the application including a diamond grinding, lapping, and polishing head. The heads can be switched quickly and easily by the user. The model has an integrated vision equipment which is used to achieve precision wafer alignment and process condition control. The vision system adjusts the alignment of the wafer to the grinding, lapping and polishing head as well as providing a readout of the spindle speed. The vision unit can also detect any defects in the wafers or the process conditions that could affect the process outcome. The machine features state-of-the-art safety features and ergonomic design for the operator. The safety features include safety screens and interlocks that prevent accidental contact with the running parts of the machine. The integrated operator interface displays alerts when the tool is not running correctly, and the operator can control process conditions and settings via the touch screen display. DAG 810 Wafer Grinding, Lapping and Polishing Asset from DISCO is reliable and efficient, offering excellent surface finishes and uniform and repeatable results. The model has sophisticated safety features and an easy to use interface, making it the ideal choice for a wide range of single-side grinding, lapping and polishing applications.