Used DISCO DAG 810 #9252476 for sale

DISCO DAG 810 is a wafer grinding, lapping, and polishing equipment that is designed for grinding planar surfaces or non-planar surfaces of very thin wafers and substrates. DISCO DAG810 system can be used to grind, lap, and polish semiconductor, ceramic, and optical materials. DAG 810 consists of three components; a grinder, lapper, and polisher. The grinder uses an oscillating diamond-coated grinding wheel with a controllable depth of cut. The grinder can process a wide variety of materials, including silicon, gallium arsenide, gallium nitride, and other materials with a depth of cut up to 150 microns. The lapper uses a rotating diamond-coated lapping plate with a controllable depth of cut. The lapper can process a wide variety of materials with a depth of cut up to 2.5 um. The polisher uses a rotating diamond-coated polishing bottle with a controllable pressure up to 2000 mPa. The polisher can process a wide variety of materials with a spindle speed up to 3000 rpm and a pressure up to 10 n which results in a very accurate substrate profile with very high resolution. DAG810 can be used to grind and lap flat surfaces, including semiconductor wafers, solar cells, machine parts, and much more. The unit can be integrated into an automated process for wafers. In addition, DISCO DAG 810 can be used to finish intricate components such as optical systems, precision mechanical parts, and more. Moreover, the machine is designed with a wide variety of diamond-coated grinding and lapping tools, allowing users to select the most suitable tool for their application. DISCO DAG810 is equipped with a variety of safety features, including a safety hood, emergency stop button, and safety interlocks. The safety hood protects operator's eyes during operations, and the emergency stop button can be pressed to immediately shut down the tool in case of an emergency. Furthermore, the asset is equipped with an auto-start function, as well as a retractable arm for quick and effortless loading/unloading of wafers. Overall, DAG 810 is a robust and user-friendly model that can be utilized to grind and lap flat and non-planar surfaces of very thin wafers and substrates, as well as finish intricate components. The equipment can be used in various applications such as semiconductor wafer grinding, solar cell grinding, machine part finishing, and more.