Used DISCO DAG 810 #9261903 for sale

DISCO DAG 810 is a wafer grinding, lapping, and polishing equipment which is designed for grinding, lap and polishing wafers. The cutting-edge design of the system features a single grinder-polisher with the capacity to process any size or shape of semiconductor wafer, from 12" to 100" in diameter. The unit is composed of a cutting chamber, grinding disk, and a polishing pad. The cutting chamber is capable of housing up to eight grinding and/or polishing disks. The cutting chamber also has a special hexagonal design which allows for precise and efficient wafer grinding, lapping, and polishing results. The grinding disk is designed with a special geometry that allows for grinding in both the radial and axial directions. The geometry is such that it allows the grinding to be performed with the wafers in any orientation. This ensures that the grinding process is completed while the wafers are in the best possible position for consistent and repeatable results. The polishing pad is a highly engineered formulation of suction pads that are designed to ensure a uniform and continuous polishing motion. This allows for high-precision results that are much finer than what can be accomplished with traditional polishing techniques. The suction pads also help to keep the wafer flat and help prevent any bowing caused by the grinding and polishing process. DISCO DAG810 allows for maximum throughput due to its design which reduces material handling and disc changes. The machine also features a user-friendly interface that allows users to quickly and easily select the appropriate parameters for their application. DAG 810 is capable of producing wafers with a wide range of specularities, with a polished surface that is smooth and defect-free. This tool is ideal for use in the semiconductor industry, where surface finish and control is of utmost importance. By providing high precision results, DAG810 is the perfect solution for any grinding, lapping and polishing requirement.