Used DISCO DAG 810 #9263201 for sale

DISCO DAG 810 is a wafer grinding, lapping and polishing system developed for the semiconductor industry. It is designed for processing a variety of wafer materials up to 8 inches in diameter and up to 10mm thick. This system is fully automated and computer-controlled, meaning that it can achieve a high degree of precision and accuracy in each of its operations. DISCO DAG810 is a fully enclosed unit, allowing for a safer and cleaner working environment. The grinding, lapping and polishing processes can all be carried out in the same machine and within the same cycle. This greatly reduces process time and increases yield. DAG 810 is equipped with a granite base and special precision bearings which means that it can not only hold the material securely during grinding, lapping and polishing, but also ensure the utmost in accuracy and safety. The unit is also fitted with filtration units which keep the working environment free of dust particles, helping to reduce health risks to the operator and contamination of the wafer surface. The grinding, lapping and polishing processes are all controlled by the integrated controller panel. This panel allows the operator to program the exact parameters required to carry out the task. It also provides feedback on the progress of the processes, helping to ensure the highest degree of accuracy. The panel also includes an emergency stop button in case of an unexpected incident. DAG810 is also equipped with some automated functions such as automatic wafer thickening and centering to reduce the amount of manual labor involved in preparing the wafer for processing. DISCO DAG 810 also includes a high pressure lapping system which allows for a higher lapping force and higher-precision lapping surfaces. Finally, DISCO DAG810 is also equipped with a polishing stage, allowing it to achieve high levels of surface finish brightness. Overall, DAG 810 is an excellent choice for wafer grinding, lapping and polishing requirements. It is easy to use and provides outstanding results, helping to increase yield and reduce costs. The highly automated nature of this unit also greatly simplifies the process and reduces the amount of manual labor involved.