Used DISCO DAG 810 #9273091 for sale

DISCO DAG 810 is a surface-grinding, lapping, and polishing equipment designed for the precise processing of wafers and substrates for the semiconductor and electronics industry. Its advanced materials and design engineering provide excellent performance and flexibility for today's leading-edge production requirements. DISCO DAG810 enables accurate, repeatable surface-grinding of wafers and substrates with a high degree of precision. Its integral wafer-clamping system allows fast loading and unloading of wafers and minimizes manual handling. It also accurately grinds both planar and cylindrical workpieces with a range of diamond and abrasive wheels. The lapping and polishing process on DAG 810 produces flat and smooth surfaces on the workpieces with excellent repeatability. Its robust conditioning technology allows the user to set the surface-profile to the desired specification with precision. And its powerful vibration-free drive unit consists of a high torque, double-ended DC motor that provides good surface finish quality at high production speeds. In addition, the state-of-the-art programming functions of DAG810 control machine enables the user to setup repeatable process parameters for each type of application. Through its intuitive graphical interface, users can conveniently set and control grinding parameters such as feed rate, speed and tool pressure for optimal results. DISCO DAG 810 is capable of working with a wide range of substrates, including quartz, silicon, gallium arsenide, polyimide, and ZnSe. Its versatile materials options permit grinding, lapping and polishing of different types of materials with ease. Overall, DISCO DAG810 is a highly-refined wafer grinding, lapping and polishing asset that provides superior repeatability and accuracy for the semiconductor and electronics industry. By combining powerful and accurate precision engineering with advanced software automation, highly precise results can be achieved for a broad range of materials.