Used DISCO DAG 810 #9276854 for sale

DISCO DAG 810 is a wafer grinding, lapping and polishing self-contained, fully automated equipment. It is designed to provide precision machining of wafers and flats to very tight specifications. The system consists of a host of high-end components, including a CCD camera systems, ultra-precision work stage, micro-controlled motor drive, powerful drive motors, flexible abrasive belts, laser interferometer and a unit control platform. The CCD camera is used for capturing high-resolution images of the workpiece, which is then analyzed for precisely locating the edge of the wafer and defining the machining parameters. The ultra-precision work stage ensures reliable and repeatable machining results. The micro-controlled motor drive provides accurate and smooth cutting motion, allowing for tight tolerance machining. The powerful drive motors provide superior power for high cutting speeds and maximum throughput. The flexible abrasive belts offer an effective, cost effective method for surface grinding. The laser interferometer ensures accurate workpiece positioning and adjustment, while the machine control platform allows for easy operation and program configuration. DISCO DAG810 is designed to seamlessly integrate with peripheral equipment, such as robots, spin coaters and conveyers, to form a complete wafer processing tool. Different machining technologies can be selected, such as lapping and polishing, electrochemical grinding and laser machining, to provide target defined surface finishes up to super-polished standards. The automated systems ensure consistency, repeatability and performance in every operation cycle. DAG 810 offers an economical and efficient solution for machining and lapping large numbers of wafers and flat surfaces. The asset is equipped with safety mechanisms such as overheating, dustcollecting and dust-removing functions, to provide dust-free and safe working environment. DAG810 offers superior performance and productivity for precision machining of large numbers of wafers and flat surfaces.