Used DISCO DAG 810 #9384800 for sale

DISCO DAG 810 is a state-of-the-art wafer grinding, lapping and polishing equipment. This system provides reliable, repeatable and uniform results at ultra-high precision levels. The unit features a large processing area, up to 410mm (16in.) in diameter, allowing wafer production on two sides. The machine includes an adjustable speed spindle along with various spindle speeds and feed rates, allowing for both fine and coarse grinding. Further, multiple grinding, lapping and polishing processes can be combined in a single integrated tool, providing high-precision machining capabilities. The spindle head is essential to producing high-precision machining results and minimising tool wear. The spindle head of DISCO DAG810 is specially designed to minimise tool contact and friction between the wafer and lapping/polishing plates or wheels. As well, this spindle has been designed for low-vibration operation, meaning fewer accidental defects in wafer production. The asset has a process control model that facilitates the setting of parameters and the display of machining results. The controller enables users to quickly select the required settings for the job being performed and make sure the correct specifications are being followed. DAG 810 is designed for use in a variety of applications, such as semiconductor and MEMS production, as well as for general optoelectronic applications. The equipment can also be used for die-bond and substrate lapping, wafer mounting and flip-chip bonding. It has been built to achieve the highest precision possible, making it well-suited for production of micro-electronic components. The system is equipped with a series of safety features in order to prevent wear and tear on components and accidental damage to the workpiece. These include an extendable shield to protect the operator and a series of sensors to detect collision detection and abnormal temperatures. In conclusion, DAG810 is well-equipped to meet the needs of various industries. This advanced wafer grinding, lapping and polishing unit provides reliable, repeatable and uniform results, suitable for the production of micro-electronic components. The adjustable speed spindle and process control machine facilitate the machining process and promote safety and high-precision levels.