Used DISCO DAG 810 #9389541 for sale

DISCO DAG 810 is a wafer grinding, lapping and polishing equipment specially designed for the treatment of semiconductor wafers. The system consists of an upper and lower abrasive belt grinding head and tape, an upper and lower film polishing unit, a milling unit, a polishing roller, a double-sided polishing machine, an operator's control panel, and a coolant unit. The abrasive belt grinding head and tape provide grinding, deburring, and finishing of semiconductor wafer edges during the rough machining process. The upper and lower film polishing units are equipped with anti-fouling and anti-scratching films and can efficiently polish wafers with a high precision to very low roughness. The milling unit ensures precise removal of glass beads and other objects on the wafer's surface. The polishing roller is used to polish the entire wafer to a uniform precise finish. The double-sided polishing machine is designed to simultaneously polish both sides of the wafer, with a uniform process. The operator's control panel enables precise adjustment of parameters such as speed, force and pressure, as well as ensuring consistent positioning and precise automation of the operator to achieve precise and repeatable results. The cooling machine is crucial to the proper functioning of DISCO DAG810 and helps to optimize the polishing process. The cooling tool is equipped with a circulation pump that helps to maintain the temperature and humidity of the air in the DAG's installation room. In conclusion, DAG 810 is an advanced wafer grinding, lapping and polishing asset that combines precision and repeatability to provide an effective solution for the treatment of semiconductor wafers. Its robust design ensures a safe working environment and precise results.