Used DISCO DFG 810 #293759312 for sale

DISCO DFG 810 is a "wafer grinding, lapping, and polishing" equipment designed to enable high-precision processing of brittle and hard materials such as silicon, ceramics, and semiconductor wafers. It is an ideal machine for surface finishing, especially in the semiconductor industry. The system is equipped with a multi-ladder grinding library featuring a variety of grinding attachments, enabling numerous sample sizes and grinding patterns to be created. This machine is capable of both single-sided flat grinding and double-sided grinding with the same grinding results. Furthermore, it is equipped with a high-precision, PLC controlled rotary table and a dynamic auto-feed capability for efficient and repeatable sample grinding results. Additionally, the unit features a built-in vacuum machine that works in tandem with the grinding and lapping process, ensuring the particles are collected and removed from the tool. This helps assure that dust particles do not contaminate the samples and improve the quality of the finished product. Furthermore, the asset includes a built-in cooling model for reducing the heat generated by the grinding and lapping process. This helps reduce the risk of damage to the sample as well as help prolong the life of its mechanical components. Furthermore, the equipment is built with a safety monitor system that ensures operator safety. It visually and audibly alerts the operator of any potential hazardous operation conditions and will automatically shut down the unit if necessary. Finally, the machine is equipped with a high-precision measurement tool and versatile software choice for maximum process accuracy and control. This helps to guarantee results with minimal variations between samples. Overall, DFG 810 is a reliable asset for wafer grinding, lapping, and polishing applications. It is designed to meet the rigorous demands of the semiconductor industry and will help deliver consistently high-precision results that are repeatable and reliable.