Used DISCO DFG 821 F/8 #293766156 for sale

DISCO DFG821F/8 is bulk-processing wafer grinding, lapping and polishing equipment that offers precision production processes for industrial applications. This system is an advanced single-side grinding machine designed for efficient wafer thinning processes. The unit is equipped with a flat display machine, integrated visualization featuring both actual process parameters and workflow, and it is specifically designed to improve wafer grinding precision with various cutting-edge technologies such as DISCO award-winning wet-etch technology, ultraviolet light intensity control, and low-loss grinding. DISCO DFG 821F/8 is an efficient and cost-effective option for mass production processes with its large processing surfacing range from Ø20mm to Ø200mm. The dry-type grinding process eliminates the need for liquid cooling, significantly reducing the complications associated with water lines and condensation. The machine also features a stepper motor, delta-type automatic grinding wheel assembly, and a unique layered structured wheel guard for additional safety. The machine utilizes an integrated integrated computing tool for control and monitoring of processing parameters and operation. The work area is temperature and vibration controlled, and the asset offers comprehensive analysis of the process performance and a range of particle analysis to ensure the highest precision wafer results. The machine includes an intuitive user interface for quick operation and an opto-electronic unit for optical inspection. For advanced control and monitoring, the machine offers a wide selection of hardware and software modules. DISCO DFG821F/8 also features a number of advanced process control features, such as stationary, scanning, and random grinding patterns, as well as surface texture control, feedback auto-correction, and the ability to fine-tune grit selectivity and pass-rate adjustment for different sized wafers and different lapping speeds. Further options include the integration of a wafer chuck and an automated film layer measurement. Overall, DISCO DFG 821F/8 is a powerful, reliable, and precise wafer grinding, lapping, and polishing model that offers unsurpassed capability and precision. Using DISCO cutting-edge technologies, the machine delivers reliable, accurate, with repeatable results for industrial production lines. This equipment offers particle analysis, advanced process control software, temperature and vibration control, and a range of hardware and software modules for a complete grinding, lapping and polishing solution.