Used DISCO DFG 821 F/8 #9358726 for sale

DISCO DFG 821 F/8 is a high-performance wafer grinding, lapping & polishing machine specially designed to accommodate ultra-fine machining of silicon wafers up to 8 inches (203 mm) in diameter. It is a fully automated, stand-alone equipment consisting of a grinding and polishing station, a polisher system, and a spin-coater for applying lubricants and protective coatings to the wafer. The machine is capable of performing extremely precise grinding operations to achieve the highest quality surface finish attainable. The grinding station consists of a mounted spindle equipped with a diamond wheel mounted on the outboard side, allowing for easy access to the grinding parameters such as depth of cut, speed of rotation, and type of abrasive. The stationary platen can also be adjusted for the placement of the wafer in order to achieve the desired surface finish. The machine is equipped with a non-contact air-bearing spindle to provide precision grinding while protecting the surface from thermal damage. The polishing station features an enclosed polishing chamber that is connected to a pressure tank that contains a mixture of diamond abrasive and isopropyl alcohol. The pressure tank can be adjusted to optimize the force applied to the wafer during polishing, ensuring uniform polishing and a superior final finish. The spin-coater is designed to dispense a uniform layer of lubricant or protective coating onto the wafer during polishing to ensure uniform surface finishing. DISCO DFG 821 F/8 is equipped with automatic loading and unloading of wafers, allowing several wafers to be processed in one cycle. This unit also features an intuitive LCD control panel for easy programming and monitoring of the grinding and polishing processes. In addition, this machine is compatible with multiple facets of grinding/polishing processes, including bench-top bench-top lapping, single-sided lapping, and multi-facet grinding. DISCO DFG821 F/8 is capable of achieving extremely high machining accuracy and surface quality, making it ideal for semiconductor circuit fabrication, MEMs (micro-electromechanical systems) fabrication, and other related industries. This machine is both reliable and efficient, allowing customers to reliably produce high-quality wafers while keeping production costs to a minimum.