Used DISCO DFG 821 F/8 #9360801 for sale

DISCO DFG 821 F/8 is a state-of-the-art wafer grinding, lapping and polishing equipment developed and produced by DISCO Corporation, a Japan-based manufacturer of advanced manufacturing equipment. The system combines grinding and lapping with its unique clean grinding technology and lapping plate features to create a finish that surpasses traditional grinding and polishing processes. DISCO DFG 821 F/8 consists of a series of high-precision components designed to maximize wafer grinding, lapping and polishing efficiency. The grinding head of the unit is outfitted with a diamond grinding wheel that allows for precise control of the width and depth of the grinding path. The counter-rotating grinding spindle operates at variable high-speed for optimal results with minimal material fatigue. A series of lateral positioning and height settings can be used to optimize the machine for a variety of grinding, lapping and polishing tasks. The lapping plate, which rotates with several options, guarantees consistent surface finish for even the most challenging applications. The adjustable lapping plate is fitted with a special polishing cloth to provide uniform polishing coverage. Safety features on DISCO DFG 821 F/8 include speed limit switches, an active cooling tool to reduce heat during operation, an emergency stop button, and a high-strength steel frame for reliable support. An integrated process monitoring asset utilizes a number of diagnostic indicators to help maintain precision and control. DISCO DFG 821 F/8 is ideal for use in the production of precision wafers for medical, semiconductor, aerospace and other advanced applications. Its combination of advanced technology and superior construction make it an excellent choice for anyone looking to increase their productivity and reduce costs. With its efficient processing times and consistent results, DISCO DFG 821 F/8 is a great choice for any precision grinding, lapping and polishing application.