Used DISCO DFG 82IF/8 #9068719 for sale

ID: 9068719
Wafer Size: 6"
Vintage: 1989
Wafer back grinder, 6" 1989 vintage.
DISCO DFG 82IF/8 is a multi-functional wafer grinding, lapping and polishing equipment designed to provide optimal grinding and processing results for various applications in the semiconductor industry. This innovative system is capable of grinding, lapping, and polishing of wafers up to 8 inches (200 mm) in diameter. It is specifically designed to achieve high precision results while utilizing advanced technology and automated processes. The unit consists of a grinding and polishing unit and an integrated semiconductor wafer handling machine. The grinding and polishing unit is equipped with two high-precision grinding heads which are capable of processing wafers in a variety of shapes and thicknesses. The unit also includes a diamond-polishing option which gives a superior polishing performance. The integrated wafer handling tool allows for the precise control of wafer orientation and positioning as well as the ability to conveniently retrieve and inspect the processed wafers. DISCO DFG-82IF/8 utilizes a range of advanced features to ensure a precise and reliable processing. It is equipped with a direct-drive motor which allows for high speed and precise control of the grinding process. The asset also includes advanced vibration suppressing features which reduce vibration while maintaining the accuracy and precision of grinding and polishing operations. Moreover, the model utilizes an automated pickup arm which allows for precise placement and retrieval of the processed wafers. DFG 82 IF/8 also incorporates a series of safety features which guarantee a safe and reliable operation. The equipment includes a full-featured safety interlock system which will ensure that the machine is turned off until it is properly inspected and all safety protocols are met. In addition, the unit includes an emergency power-off switch for quickly deactivating the machine. In conclusion, DFG 82IF/8 is a specialized wafer grinding, lapping & polishing tool which is capable of delivering superior precision and performance in various applications. It is equipped with a range of advanced features and safety protocols which guarantees reliable and precise operation in a safe and secure fashion.
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