Used DISCO DFG 82IF/8 #9374771 for sale
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ID: 9374771
Wafer Size: 8"
Vintage: 1995
Grinder, 8"
Grinding method: In-feed grinding with wafer rotation
Operating modes: Fully-automatic mode and manual mode
Spindle system:
Air spindle: 2-Axes (Single-spindle version selectable)
Direct drive high-frequency motor: 4.2 kW
1000-7000 RPM
Revolving speed / Electrical current real-time display function incorporated
Vertical stroke: 100 mm
Vertical in-feed speed range: 0.0001 to 5.000 mm / Sec
Vertical rapid feed speed: 600 mm / min
Maximum step of vertical displacement: 0.001 mm
Minimum vertical resolution: 0.05 µm
Angle adjustment: X / Y-Axis direction tilting mechanisms in the spindle housing
Height gauge:
Measurement range: 0-1000 µm
Resolution: 0.5 µm
Accuracy: 1 µm
Turntable:
Diameter: 500 mm
Index angle: 180° Reversible
(2) Tables
Wafer chuck table:
Type: Porous
Chucking method: Vacuum chucking
Revolving speed: 1-500 RPM
Applicable wafer size diameter: 8"
(2) Chuck tables per turntable
Settings for dwell after grind: 0-100 Revolutions
Chuck table cleaning: Back-flushing of water and compressed air is combined
With scrubbing by brush and oilstone
Grinding wheel: Diamond wheel, 8"
Wafer loading / Unloading:
Wafer carrier storage quantity: (2) Carriers parallel (Loader and unloader)
Spinner table: Water cleaning plus drying of both sides
Throughput: 60 Wafers / hr
Wafer size: 6"
Grinding depth: 20 µm
Accuracy:
Parallelism (TTV): 0.003 mm
Thickness variation between wafers: ±0.003 mm
Operating control:
Nonglare monitor: 12"
CRT Illumination color: White
Operation panel:
Composed of function keys
Numeric keys
Auxiliary keys
Cursor keys
Operating controls
Manual keyboard: Used for manual operations in which minute manipulation
(3) Relocated places: Center / Loader / Unloader
(13) Grinding / Cleaning water supply unit (Waste method type):
Tank capacity: 401 L (10.6 gal)
Water flow rate: 30 L/min (7.9 GPM)
Pressure: 3 kgf/cm² (42.6 PSI)
Filter: 5 µm
Water: Deionized water
Vacuum pump unit:
Air exhaust rate: 370/450 e/min (50/60 Hz at 160 Torr)
Pressure: 25 Torr
Motor rating: 1.5 kW
Water consumption rate: 5 L/min (1.32 GPM)
Water quality: City water
Alarm signal tower Colors: Green, orange, red
PC Output interface:
Data transmission mode: Full duplex
ASCII / JIS Codes
Data format: Start-stop system
Data rate: 4800 baud
Data signaling format: EIA RS-232C
Air pressure:
5.0 kgf/cm².G - 8.0 kgf/cm².G
71 psi.G - 113.6 psi.G
Pressure variation range: 0.3 kgf/cm².G (4.26 psi-G) or less
Blade hose: 15x22 mm
Flow rate: 500 N/min
Dew point: -15°C or Lower
Residual oil contents: 0.1 ppm wt/wt
Ground resistance: Class 3, 100Ω or less
Noise: 1000 V or Less at a pulse width of 500 NS (Square wave)
Dual-spindle version: 17 kVA
Power supply: 200 VAC ±10%, 3-Phase, 50/60 Hz.
1995 vintage.
DISCO DFG 82IF/8 is a wafer grinding, lapping and polishing equipment capable of achieving ultra-precise surface quality and high-precision step lapping processes. Its processing capacity of up to 1000 mm in diameter allows for a variety of complex device fabrication and thin film production applications. The grinding, lapping and polishing processes are manually programmable for custom designs. DISCO DFG-82IF/8 is equipped with an intuitive, intuitive, integrated user interface for precise, intuitive control of all application functions. Specialized jigs, tools and fixtures are provided for surface lapping operations, up to a thickness of 1μm. DFG 82 IF/8 is equipped with two separate grinding modules - one for grinding and one for lapping operations. Each module is equipped with variable speed motors for optimal speed control during operation. Both modules can operate in conjunction with the optional Automatic Feeder System for increased efficiency and accuracy. The grinding module is equipped with a range of adjustable abrasive media, for wafer size up to 1000 mm. High quality, diamond-impregnated grinding tools are provided to accomplish the highest polish quality and lapping tolerances. Furthermore, the grinding unit is designed with a machine of polishing baskets to achieve ideal surface contact during processing. The lapping module is provided with two separate motorized platforms for +/- direction lapping motions. Specialized lapping plates are provided with various grits and sizes, for optimized results with the highest precision achievable. DFG-82IF/8 is provided with the features necessary to achieve the best grinding, lapping and polishing results, with the ease of operation. For lapping plates with various grits and sizes, DISCO DFG-82I F/ 8 can produce ultra-high-quality optical surfaces. Furthermore, the compact design of the tool allows easy operation and unobstructed access to the work area, providing a safe and comfortable working environment.
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