Used DISCO DFG 82IF/8 #9374771 for sale

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ID: 9374771
Wafer Size: 8"
Vintage: 1995
Grinder, 8" Grinding method: In-feed grinding with wafer rotation Operating modes: Fully-automatic mode and manual mode Spindle system: Air spindle: 2-Axes (Single-spindle version selectable) Direct drive high-frequency motor: 4.2 kW 1000-7000 RPM Revolving speed / Electrical current real-time display function incorporated Vertical stroke: 100 mm Vertical in-feed speed range: 0.0001 to 5.000 mm / Sec Vertical rapid feed speed: 600 mm / min Maximum step of vertical displacement: 0.001 mm Minimum vertical resolution: 0.05 µm Angle adjustment: X / Y-Axis direction tilting mechanisms in the spindle housing Height gauge: Measurement range: 0-1000 µm Resolution: 0.5 µm Accuracy: 1 µm Turntable: Diameter: 500 mm Index angle: 180° Reversible (2) Tables Wafer chuck table: Type: Porous Chucking method: Vacuum chucking Revolving speed: 1-500 RPM Applicable wafer size diameter: 8" (2) Chuck tables per turntable Settings for dwell after grind: 0-100 Revolutions Chuck table cleaning: Back-flushing of water and compressed air is combined With scrubbing by brush and oilstone Grinding wheel: Diamond wheel, 8" Wafer loading / Unloading: Wafer carrier storage quantity: (2) Carriers parallel (Loader and unloader) Spinner table: Water cleaning plus drying of both sides Throughput: 60 Wafers / hr Wafer size: 6" Grinding depth: 20 µm Accuracy: Parallelism (TTV): 0.003 mm Thickness variation between wafers: ±0.003 mm Operating control: Nonglare monitor: 12" CRT Illumination color: White Operation panel: Composed of function keys Numeric keys Auxiliary keys Cursor keys Operating controls Manual keyboard: Used for manual operations in which minute manipulation (3) Relocated places: Center / Loader / Unloader (13) Grinding / Cleaning water supply unit (Waste method type): Tank capacity: 401 L (10.6 gal) Water flow rate: 30 L/min (7.9 GPM) Pressure: 3 kgf/cm² (42.6 PSI) Filter: 5 µm Water: Deionized water Vacuum pump unit: Air exhaust rate: 370/450 e/min (50/60 Hz at 160 Torr) Pressure: 25 Torr Motor rating: 1.5 kW Water consumption rate: 5 L/min (1.32 GPM) Water quality: City water Alarm signal tower Colors: Green, orange, red PC Output interface: Data transmission mode: Full duplex ASCII / JIS Codes Data format: Start-stop system Data rate: 4800 baud Data signaling format: EIA RS-232C Air pressure: 5.0 kgf/cm².G - 8.0 kgf/cm².G 71 psi.G - 113.6 psi.G Pressure variation range: 0.3 kgf/cm².G (4.26 psi-G) or less Blade hose: 15x22 mm Flow rate: 500 N/min Dew point: -15°C or Lower Residual oil contents: 0.1 ppm wt/wt Ground resistance: Class 3, 100Ω or less Noise: 1000 V or Less at a pulse width of 500 NS (Square wave) Dual-spindle version: 17 kVA Power supply: 200 VAC ±10%, 3-Phase, 50/60 Hz. 1995 vintage.
DISCO DFG 82IF/8 is a wafer grinding, lapping and polishing equipment capable of achieving ultra-precise surface quality and high-precision step lapping processes. Its processing capacity of up to 1000 mm in diameter allows for a variety of complex device fabrication and thin film production applications. The grinding, lapping and polishing processes are manually programmable for custom designs. DISCO DFG-82IF/8 is equipped with an intuitive, intuitive, integrated user interface for precise, intuitive control of all application functions. Specialized jigs, tools and fixtures are provided for surface lapping operations, up to a thickness of 1μm. DFG 82 IF/8 is equipped with two separate grinding modules - one for grinding and one for lapping operations. Each module is equipped with variable speed motors for optimal speed control during operation. Both modules can operate in conjunction with the optional Automatic Feeder System for increased efficiency and accuracy. The grinding module is equipped with a range of adjustable abrasive media, for wafer size up to 1000 mm. High quality, diamond-impregnated grinding tools are provided to accomplish the highest polish quality and lapping tolerances. Furthermore, the grinding unit is designed with a machine of polishing baskets to achieve ideal surface contact during processing. The lapping module is provided with two separate motorized platforms for +/- direction lapping motions. Specialized lapping plates are provided with various grits and sizes, for optimized results with the highest precision achievable. DFG-82IF/8 is provided with the features necessary to achieve the best grinding, lapping and polishing results, with the ease of operation. For lapping plates with various grits and sizes, DISCO DFG-82I F/ 8 can produce ultra-high-quality optical surfaces. Furthermore, the compact design of the tool allows easy operation and unobstructed access to the work area, providing a safe and comfortable working environment.
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