Used DISCO DFG 82IF #293642804 for sale

DISCO DFG 82IF is an advanced wafer grinding, lapping and polishing machine specially designed for precision and fine grinding of semiconductor materials. It offers a maximum sample size of 8 inch (200mm) and is capable of achieving nanometer level accuracy with its integrated distortion-free grinding and lapping mechanism. The machine is equipped with precision drive systems to ensure excellent control over the grinding and polishing process. The wafer grinding equipment is designed to obtain superior surface quality while removing hardened bare silicon layer, thinning a silicon wafer and flattening it by polishing the two sides of a silicon wafer simultaneously. The system excels at producing high-precision flat surfaces with minimal deformation. It also supports high-precision grinding and lapping on thin-film structures, with uniform thickness and low surface roughness. Moreover, it provides excellent surface smoothness and uniformity, enabling the production of thin wafers with high quality surface finish. The wafer lapping unit of DISCO DFG-82/IF uses ceramic slurry and nickel slurry for the polishing process. The lapping machine includes a rotating lapp-plate, which helps to reduce grinding time and the risk of damage to the wafer surface, enabling precise, low-viscosity lapping in all wafer sizes. Moreover, the lapping tool helps to produce wafers with precise uniformity and low surface roughness, making them suitable for a wide range of applications. The integrated distortion-free grinding and polishing asset helps to keep the wafers in position during the entire grinding and polishing process without introducing additional stresses or distortions. The model also features a temperature monitoring equipment which helps to keep the temperature within precise tolerances, thus ensuring the surface finish of the wafers is constantly maintained. DISCO advanced grinding, lapping and polishing system provides superior performance and precise surface finish resulting in better yields. It is also highly efficient, reducing the time required to produce wafers by up to 50% and increasing throughput. The unit is extremely reliable, with a reliable and easy to maintain setup for maximizing efficiency and output. Furthermore, it is convenient to use and includes advanced safety features, making it one of the safest and most reliable wafer grinding, lapping and polishing systems on the market.