Used DISCO DFG 82IF #9276397 for sale

DISCO DFG 82IF wafer grinding, lapping & polishing equipment is a cutting-edge process control system that helps to achieve superior surface finishes for a variety of substrate sizes and geometric complexities. The unit is designed to help manufacturers produce ideal substrates for VLSI circuit chip production and other related electronic components. The machine is equipped with a wide variety of fitting tools for easy installation and maintenance, making it ideal for precision grinding and polishing. It consists of a two stage wafer holder with a rotating wafer grinding wheel and a separate polishing wheel. The tool can be set up to provide 12- to 300-mm rotation of the grinding wheel, allowing for the adjustment of radial and angular positions to meet individual needs. Additionally, the asset features an adjustable pressure and tilt control for precise and even polishing. DISCO DFG-82/IF uses a powerful, versatile and user-friendly controller to automate the grinding and polishing process, allowing for repeatable results and easier maintenance. This controller utilizes a powerful proprietary algorithm that can fine-tune the various parameters, while providing detailed monitoring and adjustment of the pressure, tilt rate, and speed throughout the process. The model is also equipped with an advanced software package that provides accurate process monitoring and analysis of grinding and polishing operations. With the correct settings, the equipment can help users achieve a superior surface finish over a wide range of substrate sizes and compositions. In general, DFG 82 I/F wafer grinding, lapping & polishing system is designed to provide a precise, repeatable, and dependable surface grinding and polishing process. The unit is suitable for multiple purposes and works well for high speeds up to 15,000 rpm. All in all, DFG-82/IF is a reliable and efficient solution for all types of grinding and polishing operations.