Used DISCO DFG 82IF #9378298 for sale

DISCO DFG 82IF is a highly advanced wafer grinding equipment designed for a wide variety of applications. It is an integrated system consisting of a grinding station, lapping station, and polishing station, which can be used to achieve high levels of grinding, lapping, and polishing on a variety of materials. This highly precise and versatile unit is capable of producing extremely high yields with very small grinding rates, making it the ideal machine for complex, custom, and high-precision applications, such as those required in the semiconductor industry. The grinding station of DISCO DFG-82/IF is equipped with a diamond disk grinding wheel and can be used to grind and cut wafers, producing a smooth, mirror-like finish. It is capable of grinding and cutting a wide range of materials such as glass, ceramic, quartz, and other types of hard and brittle materials. The grinding wheel has a slim profile and is designed to minimize waste material and optimize yield. The wheel can also be set up for directional grinding, which can produce more consistent results. The lapping station of DFG 82 I/F enables the user to precisely flatten and even out the surface of a wafer, using abrasive and polishing media. This station can be used for double-sided lapping, allowing for improved surface uniformity and better-defined edges. In addition, the lapping station is capable of accommodating a wide variety of abrasive and polishing media, allowing for the processing of a broad range of materials. The polishing station of DISCO DFG 82 I/F uses a highly specialized buffing wheel, designed to achieve extremely uniform and polished surfaces. This station enables the user to produce surfaces with extremely low surface roughness and extremely detailed patterns. The buffing wheel is adjustable and can be set to a wide range of stiffness values, allowing for the processing of a wide range of materials. DFG-82/IF is an extremely efficient wafer grinding tool, capable of producing extremely high yields with very small grinding rates. Its integrated grinding, lapping, and polishing stations allow for the processing of a wide variety of materials and the production of highly uniform and polished surfaces. DFG 82IF is the ideal solution for complex, custom, and high-precision applications.