Used DISCO DFG 83H/6 #293774136 for sale

DISCO DFG 83H/6 Wafer Grinding, Lapping and Polishing equipment is designed to provide fast, efficient, and precise grinding and finishing of semiconductor wafers up to 8 inches in diameter. The highly automated system features a 4-axis CNC-controlled table drive and dual diamond-abrasion grinding wheels, with a maximum grinding speed of 100mm/sec and a polishing speed of up to 5mm/sec. The diamond abrasive wheels enable superior abrasion performance, as well as superior surface quality, with minimal material stresses. The polishing capability of DISCO DFG 83H6 Wafer Grinding, Lapping and Polishing unit ensures a high level of surface quality, as well as a uniformity of the grinding and polishing edges. The machine includes an on-board multi-axis CNC tool with a user-friendly touchscreen interface, allowing for automated grinding, lapping and polishing operations. The user can create complex profiles, 3D contours and shape-mapped parts with ease. DFG-83H/6 Wafer Grinding, Lapping and Polishing Asset features an efficient in-feed model that is designed to provide superior performance with a minimum of operator input. The automated loading/unloading of wafers ensures exact and consistent positioning of the wafer blank to the grinding/polishing table, minimizing operator interaction and minimizing the risk of wafer damage. DFG 83H/6 Wafer Grinding, Lapping and Polishing equipment is designed with a high level of safety and precision in mind. An innovative advanced cooling system helps to prevent overheating of the grinding and polishing tools, thereby preventing damage to the wafer and ensuring a longer life for the unit. The machine also includes a safety interlock to protect personnel from contact with the grinding/polishing Surface during operational phase. DISCO DFG 83 H 6 Wafer Grinding, Lapping and Polishing tool's integrated process control asset allows for the monitoring of each step of the grinding and polishing process. The model offers a variety of data collection and reporting functions, including real-time process data to ensure optimum control of the grinding/polishing process. DISCO DFG-83H/6 Wafer Grinding, Lapping and Polishing equipment is a highly efficient and precise grinding/polishing solution for modern semiconductor wafer fabrication. The system's advanced technology ensures superior surface quality with minimal operator input, providing a safe and efficient production environment.