Used DISCO DFG 83H/6 #9069023 for sale

DISCO DFG 83H/6 is a wafer grinding, lapping & polishing equipment, specifically designed for the processing of materials in semiconductor manufacturing. It has a high capability to finish optical communication components such as optical chips, lasers, LED's and detectors. The machine has a rock-solid base, with an ergonomically designed work surface. It is equipped with a double-headed grinding/polishing system; one wheel is fixed to the base while the second wheel is mounted onto an adjustable arm. This arm can be adjusted to enable grinding on the outer edge of the wafer. Additionally, both grinding heads feature a quick-change unit to enable quick sample preparation and higher wafer throughput. The lapping task is achieved via surface abrasion using diamond paste and ceramic bonded abrasive polishing laps to achieve the desired level of surface finish. A permanent magnet plate is used to hold the wafers in place while they are being lapped. The plate also has a machine of channels to draw liquids away from the work area. The tool features a built-in optical profile analyzer which allows for the measurement of the topography of the wafers after grinding or polishing. It is also possible to measure optical transmission losses before and after final processing. The asset is capable of a wide range of processing, including single and double-side, flat and stepped grinding and polishing of wafers up to 200mm in diameter. The grinding speed can be set from 10 to 1,000rpm, depending on the material of the wafer and the results desired. DISCO DFG 83H6 also comes with digital controls, gas and air pressure control and an advanced dust removal model that operates at a high level of efficiency. The equipment has been designed to reduce the time spent during manual operations, and with the advanced functionality and accuracy, it increases the quality of the finished products.