Used DISCO DFG 83H/6 #9155399 for sale

DISCO DFG 83H/6 is a precision wafer grinding, lapping, and polishing machine designed to achieve precise results in just a short amount of time. This machine uses high-grade, precision grinding wheels which are covered in diamond abrasives, allowing for close tolerances in surface roughness and flatness requirements for wafer processing. The diamond abrasives provide superior accuracy and uniformity for surface grinding, lapping, and polishing, and can achieve a finish of 1 μm (RMS) or less. This machine was designed with the latest technology in mind, giving it the capabilities of handling large wafer sizes with a maximum thickness of 6". The vertical spindle is driven by a high-torque servo-motor, allowing for fast spindle acceleration and precise grinding, lapping, and polishing speeds. For added convenience, a submersible coolant system is built in to provide consistent and reliable cooling while the wafer processing is taking place. An automatic wafer loader also offers a quick and easy solution for loading, unloading, and exchanging wafers. The operator control interface on DISCO DFG 83H6 machine is very user-friendly and easy to navigate, making the machine a great choice for both inexperienced and experienced personnel. Through the interface, the operator can monitor and control various aspects of wafer grinding, lapping, and polishing, such as feed rate, spindle speed, and grinding pressure. The operator can create specialized programs for processing a variety of materials and characteristics and they can save these setting and quickly recall them for future use. In addition, DFG-83H/6 machine is equipped with a built-in vision system, allowing it to detect edge defects such as chipping, breakage, and contamination. This system can check for wafer alignment, which ensures uniform results during wafer fabrication and is an important feature when using the machine for applications such as semiconductor or optics production. Overall, DFG 83 H 6 is a proven precision grinding, lapping, and polishing machine that provides superior accuracy, versatility, and ease of use. It is a great choice for wafer processing in areas such as semiconductor fabrication, optics, and medical device production. By utilizing its automated functions and intuitive user-interface, operators can quickly and easily achieve high-precision results in a short amount of time.