Used DISCO DFG 840 #197321 for sale

DISCO DFG 840 is a precision wafer grinding, lapping and polishing equipment utilised in the manufacture of semiconductor devices. It is a cost-effective and efficient system designed to efficiently process high-quality wafers with precision and accuracy. The 840 combines a high-precision grinding unit with specifications designed for multiple processes such as lapping, polishing, slicing, laser scribing, sawing and slicing. The 840's grinding machine consists of an ultra-precision spindle and large precision wheel. The spindle is designed to run at various speeds and is capable of grinding and achieving the exact surface finish specified. The spindle's motor is able to generate high torque for efficient processing at low speeds. The wheel is designed for maximum uniformity, providing consistency and reliability across all processes. The 840's process control tool is also designed for precision and stability. It features a programmable CNC controller which simplifies user workflow and ensures precise operation with minimal error. A specialized software suite is included, with a variety of tools and programs for customizing the asset and optimising settings. Lapping and polishing are also minimally complex and precisely charge-tailored with the help of a unique rotating platen model. The platen is able to rotate at various speeds and can be configured for multiple parameters and processes. It provides superior uniformity and control with minimal error and maximum efficiency. The 840 also features various safety features designed for safety and peace of mind. The equipment is designed to detect and reject damaged wafers; stop the system if abnormal temperatures or pressures are detected; duplicate wafers to prevent potential problems; and warn when incorrect materials are used in the machine. In summary, DISCO DFG840 is a high-precision and powerful wafer grinding, lapping, and polishing unit offering superior accuracy, precision, and control. Its machine design, process control capabilities, lapping and polishing capabilities, and safety features make it an ideal fit for both advanced and general-purpose production environments that require efficient and precise production solutions.