Used DISCO DFG 840 #293601496 for sale

DISCO DFG 840 is a state-of-the-art wafer grinding, lapping and polishing equipment used for silicon, compound semiconductor, compound microelectronic, MEMS, LED and other substrates. It offers a precise, thorough and cost-effective solution for edge grinding and lapping, polishing and wafer cleaning of delicate and fragile substrates. This system is suitable for ultra-large wafers up to 840mm in diameter with a maximum processing thickness of up to 12mm. The unit features a flexible design driven by a powerful robotic automation machine. It features a total of three grinding, lapping and polishing chambers, each equipped with its own set of grinding and polishing tools, allowing for a flexible and efficient approach to the processing of both large and small-scale substrates. The individual chambers are made of rigid stainless steel construction, providing the stability and rigidity necessary to carry out multi-axis machining phases. It also features a 3-axis control tool for accurate alignment of the major feeds and a fully automated, controllable end effector asset for manipulation of the wafer from its feeder stage to the final process. DISCO DFG840 also guarantees high-precision machining with an average surface accuracy of less than 0.1 μm. It also ensures uniform edge grinding and lapping of the surface, superior polishing of semiconductor substrates for highly reflective materials, and planar polishing for surface planarization. The different levels of grinding, lapping, and polishing are all adjustable on-the-fly, allowing for quick and easy optimization of the process. Furthermore, the model provides excellent wafer cleaning performance, relying on a combination of proprietary scrubbing and humidification technologies. With its advanced features and capabilities, DFG-840 has become the preferred choice for the processing of high-precision substrates. It significantly reduces time and cost while providing superior accuracy, versatility and reliability. From wafer cutting and grinding, to lapping and polishing, the equipment enables an efficient and cost-effective approach to the processing of a wide range of semiconductor substrates.