Used DISCO DFG 840 #293609464 for sale

DISCO DFG 840 is a highly advanced wafer grinding, lapping and polishing equipment which enables the production of Planarized wafers with excellent surface flatness and low surface particles. It is the perfect choice to meet the needs of complicated product-manufacture process. In its grinding stage, DISCO DGF 840 utilizes two sets of planetary grinding wheels. These wheels provide a high degree of precision with a wide range of grinding parameters that can be customized to accommodate a wide range of different materials. The planetary rotation technique is used for uniform grinding and polishing of the wafer surface. In addition, DISCO DFG840 also features an active vibration isolation system that eliminates vibration-induced errors. To achieve optimal lapping and polishing performance, the DGF 840 uses a synchronous motor and a robust optimizer unit. The synchronous motor enables a higher degree of accuracy during the grinding and lapping process. The optimizer machine allows for finer-tuning of the wafer surface by constantly monitoring and adjusting the speed of the grinding and lapping process. Through this tool, DFG-840 ensures the highest precision results. Further, DFG840 is able to enable the production of smooth polished wafers by incorporating an integrated chemical treatment function. This feature facilitates the chemical etching of wafers to improve the surface topography and to smooth out any potential harshness left. In addition, DISCO DFG-840 is equipped with an inspection asset that uses an automated measurement technique to ensure reliable product quality. This model also helps reduce potential errors that may be caused by manual intervention. All in all, DISCO DGF 840 is an advanced wafer grinding, lapping and polishing equipment that produces high quality products with superior surface topographical features. Its numerous features make it a great solution for a wide range of product-manufacturing processes.