Used DISCO DFG 840 #293638411 for sale

DISCO DFG 840 is a fully automated wafer grinding, lapping, and polishing equipment designed to optimize the polishing process of semiconductor materials and other electronics components to improve production yields. The system features a highly efficient grind-lapping mechanism. This incorporates a dual-grit wheel with precise timing and speed control to ensure the precise grinding and lapping action required for desired results. The unit can process surfaces up to a diameter of 8 inches (or 20mm). The wafer is loaded onto the wheel and the wheel is rapidly spun. The wheel then progressively moves against the wafer's edge while maintaining precise speed and angle control of the wheel. Once the grinding process has been completed, the wheel is then reversed and the lapping process begins. The machine also features an adjustable pressure control tool which regulates the force of the grinding and lapping action on the surface of the wafer. This helps reduce material loss and improve the accuracy of the process. The lapping pressure is adjustable according to the application requirements, ensuring that the process yields excellent results. The asset also includes a polishing disc which can be used in the lapping process. The disc is driven by an adjustable frequency motor and incorporates an adjustable weir wall. This ensures that the polishing disc maintains a uniform pressure across the entire width of the wafer. This helps create a smoother and more uniform finish. In addition to the grinding, lapping, and polishing process, DISCO DFG840 also has a cleaning and conditioning process to further refine the wafer surface prior to packaging and shipment. The cleaning and conditioning module includes a number of advanced sensors which detect any remaining contaminants or stains on the wafer surface. This ensures the wafer surfaces are clean and free of any contaminants for the best possible results in packaging and shipment. Finally, the model also features a soft-start capability which prevents any damage to the wafer surface from sudden contact with the polishing disc. This helps ensure that the wafer remains damage free throughout the entire process. All in all, the Dieco DFG-840 is a powerful yet user-friendly wafer grinding, lapping, and polishing equipment designed to provide superior results every time. With its adjustable parameters, advanced features, and reliable operation, DISCO DFG-840 ensures the highest quality and precision polishing on every wafer processed.