Used DISCO DFG 840 #293647761 for sale

DISCO DFG 840 is a modern wet lapping, grinding and polishing equipment for a variety of applications in the semiconductor and optics industries. With its advanced wafer grinding technology, the system can achieve superior quality and accuracy on high end semiconductor and optics products. The unit is ideal for processing a wide range of wafers, from the smallest to the largest. DISCO DFG840 machine consists of three parts: the lapping and polishing unit, the lapping grinding unit and the polishing unit. The lapping and polishing unit features a variety of features, including an innovative disc friction press (DFP) tool, which helps to reduce processing time, while increasing wafer accuracy. The asset also features two large abrasive tables, which are capable of providing uniform lapping coverage on both sides of the wafer evenly and simultaneously. The lapping grinding unit has two abrasive disks and a wafer rotator, which is capable of running various abrasive disks at different rates. The adjustable rotational speed of the disks allows for better control over the amount of lapping and polishing necessary to achieve desired results. The polishing unit of DFG-840 model features three separate units: the aluminum oxide pad, the resin polishing pad and the ceramic polishing pad. All three of these polishing pads are interchangeable, and each can be adjusted to obtain the desired surface finish. The aluminum oxide and resin polishing pads provide an excellent finish on most surfaces, while the ceramic polishing pad is ideal for producing high quality smooth surfaces. All of these pads are also designed to work together with the lapping and polishing unit, which helps to ensure consistency in the final results. DFG840 equipment is a highly efficient solution for semiconductor and optics applications, with the flexibility to provide superior quality and accuracy for a wide range of products.