Used DISCO DFG 840 #293650924 for sale

DISCO DFG 840 Wafer Grinding, Lapping & Polishing equipment is a state-of-the-art system designed for the efficient processing of silicon, sapphire and quartz substrates for electronics and automotive applications. This unit provides a sophisticated platform for grinding, lapping and polishing wafers with a high degree of precision, accuracy, and control. The machine features a high speed spindle, which is capable of spinning up to 10,000 RPM, enabling high-speed grinding and polishing for difficult to process substrates. The high-precision linear slides allow for smooth and precise operations, allowing for higher-quality results. The tool also features a fully-automated CCD positioning asset to facilitate accurate and efficient alignment of wafer rests. The model includes an array of special-purpose grinding and polishing tools and consumables, such as diamond and alumina grinding flecks, lapping films, and polishing pads, which are tailored according to the materials to be processed and the results desired by the user. This allows the equipment to be tailored according to the application to maximize efficiency and performance. At the heart of the system lies a custom-made vibration elimination unit, which ensures smooth operation and high-quality results. This machine includes a special vibration isolation platform and active vibration damping which effectively eliminates external environmental disturbances, allowing the tool to maintain accuracy and repeatability, even across long production cycles. DISCO DFG840 comes with an easy to use, intuitive graphical user interface (GUI). This GUI allows the user to easily program and control the asset for the different applications and it also provides real-time feedback on the model's performance, allowing for easy troubleshooting. An array of cutting-edge safety features comes as standard with DFG-840. This equipment features multiple safety bars and emergency stop switches for added safety and protection of users, as well as a comprehensive range of interlocks and sensors which ensure that the system is functioning normally and safely. Overall, DFG 840 Wafer Grinding Lapping & Polishing Unit is a reliable and advanced machine designed to deliver consistent, repeatable results with high levels of accuracy and precision. This tool is ideal for efficient wafer grinding, lapping and polishing in a variety of industrial applications.