Used DISCO DFG 840 #293748003 for sale

DISCO DFG 840 is a unique ultra-high precision wafer grinding, lapping and polishing equipment designed to produce ultra-smooth surface finishes. At the heart of the system is its dual axis air turbine spindle unit with integrated vacuum and drives that are designed to feed the opposing abrasive belts. This machine operates at speeds up to 8500 rpm and is capable of processing substrates up to 8" in diameter. Additionally, the tool is equipped with an integrated high-vacuum column, enabling it to handle difficult to grind non-solvent type wafers without the need for an additional vacuum asset. The grinding and lapping process is done using a pair of abrasive belts that move over the front and back sides of the wafers. Unlike conventional grinding systems, DISCO DFG840 model eliminates the need for dressing the belts which results in improved grinding accuracy and surface finish. Depending on the process, the belts are available with diamond, ceria, alumina, garnet, or other abrasive materials to provide the most suitable material for the equipment. To aid in further precision, DFG-840 is equipped with an adjustable wafer clamp and a programmable grinding and lapping head. This combination eliminates the need to manually adjust the wafer between grind and lapping cycles, greatly improving production throughput. Additionally, the machine is equipped with a control board that allows users to indicate the number of grinding and lapping cycles, cutting speed and other parameters. The advanced software also allows the machine to autonomously change the spindle speed between operations for higher efficiency. For polishing, DFG 840 system comes with a pair of diamond-impregnated polishing pads and buffing pads that are capable of treating both sides of the wafer simultaneously. Furthermore, a custom-designed polishing head is able to independently rotate each pad for maximum accuracy, providing a high quality finish without overburns or other defects. In conclusion, DISCO DFG-840 wafer grinding, lapping and polishing unit is an ultra-precise machine that offers the highest quality finish. From the advanced air turbine spindles and lapping head, to the robust control tool and polishing pads, the asset is designed for maximum accuracy and throughput.